Epoxy Compounds For Electronic Application

Model No: N/A
Factory Location: Taiwan
Sample Request: No
Target Markets: Worldwide

Detail Information

Description :

1. Properties:
Low stress, water-proof, chemical resistance, high-temp resistance, low dielectric constant, RoHS certificated.
2. Product Applications:
Insulation, potting, adhesive, sealing, coating….For example, decoration coating, IC, LED, circuit boards, capacitor, relays, commutator, electronic parts.

Specification :

Application	One/ two components	Curing condition	Product name	Features	TDS Download
Application	One/ two components	Curing condition	Product name	Features	Chinese	English
Potting	Two	RT curing	5419A/B	Clear.	5419A/B	5419A/B
	Two	RT curing	5250A/B	Black.	5250A/B	5250A/B
	Two	RT curing	5433A/B	Low coefficient of thermal expansion.	5433A/B	5433A/B
	Two	Heat curing	5086A/B	Black color and high Tg.	5086A/B	5086A/B
Adhesive	One	Heat curing	2089, 2095, 2066	The minimum shrinkage.	2089, 2095, 2066	2089, 2095, 2066
	One	Heat curing	2070-1, 2073, 2074	High thermal conductivity,recommended for adhesion on various electronic parts.	2070-1, 2073, 2074	2070-1, 2073, 2074
	Two	RT curing	2500A/B	Fast curing.	2500A/B	2500A/B
Impregnation	Two	Heat curing	5669A/B	Low viscosity.	5669A/B	5669A/B
Flame-resistant			5350A/B, 5339A/B, 5073A/B, 5335A/B, 5007A/B, 5370A/B, 5014A/B, 5339-1A/B, 2080, 5351 A/B	UL Recognized Component (UL94 V-0.5VA)	UL information