FEATURE:
Special very Lowprofile and small size design, Wound chip construction with standard 0805 or 0603 size, with best EMI suppression effect at higher frequency 500MHz~up. And least impact to signal wave form.
APPLICATIONS:
Preventive measure against high speed signal radiation emissions such as USB 2.0, IEEE1394 or LAN interface. Best for NB, DSC, mobile device design.
Please refer to the attached film.