* State-of-the-Art Technology
* Ultra High Positioning Accuracy: +/- 2 um
* Controller of Super Fine Resolution: 0.1 um
* Window 2000® Control platform with 15" Touch Panel LCD.
* Wire Electrical Discharge Grinding equipment (WEDG)
* Offers extraordinary grinding performance, the electrode diameter can less than 0.02 mm.
* High Precision Micro Multi-Hole Machining
* The 3000 rpm highly balanced ultra precision spindle provides outstanding hole drilling and shaping features, the optimum hole diameter can be 0.03 mm.
Model No. | OCT-200MA |
---|---|
Travel (X x Y x Z) | 200 x 150 x 150 mm |
Controller Minimum Resolution | 0.1 μm |
Electrode Forming Size (min.) | 20 μm |
Minimum Hole Diameter | 30 μm |
Surface Roughness | 0.15 μm Ra |
Workpiece Weight (max.) | 30 Kg |
Space Occupied | 1400 x 1000 x 1700 mm |
Due to continuous research and development, all specications and design characteristics are subject to change without prior notice. *All the specifications are subject to change without prior notice. |