1. High precision and peeling quality, long longevity.
2. Fixed beam path, manual focusing, red beam indication.
3. Precision ball screw and linear guide rail.
4. IPC controlled worktable with visual programming motion and parameters.
5. Special designed PC with diversified products for peeling.
1. Laser power: 30W/ 55W.
2. Laser wavelength: 1064nm.
3. Cutting range ( X x Y): 200mm x 60mm.
4. Cutting line radius: 0.1 - 3.0mm.
5. Cutting speed: according to wire condition.
6. Max. empty cutting speed: 200mm/ s.
7. Positioning precision: ≤ ±0.01mm.
8. Repeat positioning precision: ≤ 0.01mm.
9. Workstation accumulative error: ≤ ±0.01mm.
10. Adjustable height range: 10mm.
11. Min. cutting slot width ≤ 0.20mm.
12. Min. facula size: 0.10mm.
13. Max. cutting speed: 100mm/ s.
14. Positioning system: by fixture.
15. Control system: Googol card, IPC, image interface.
16. Cooling system: Han’s water cooling system.
17. Workstation bearing capacity: 15kg.