1. Patented 3D micro-structure Thermal solution adapted, outstanding heat dispersion under very low water flow.
2. Supports most CPU like Intel I7& AMD Phenom II processors.
3. The universal & strengthened backplate not only prevents MB distortion but also has high compatibility for all kinds of MBs.
4. Easy installation due to 2-way tubing design which also enables upgrade to series connection of more water blocks.
5. Highly polished base to ensure excellent surface contact with heat source.
6. Supports INTEL LGA775/LGA1156/LGA1366.
7. Supports AMD socket 754/939/940.
1. Dimension: (D)45mm x (H)29mm. 2. Tubing size: (OD)8mm x (ID)6mm. 3. Weight: 180g. 4. Material: pure copper.