Description :

Consumers are requiring more features and functions for mobile phones now. Manufacturers need to design all within a small space PCB. ChipSiP offers series of mobile phone MCP to satisfy these kinds of design challenges.

Specification :

1. M71: NOR + pSRAM. -Density: 32Mb+8Mb, 32Mb+16Mb, 64Mb+32Mb -Power supply: 3.3V -Outline: 7x9mm

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  Wireless Mcp Solutions
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  Computing Mcp Solutions
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  Smart Phone MCP Solutions
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  MCP Modules (DSC Modules)
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  Dsc/dv Mcp Solutions