Description :

1. Mini-ITX fanless chassis with innovative passive thermal cooling-only for OEM/ODM projects.
2. Only designed for ODM/OEM projects with Mini-ITX form factors M/B; MOQ requirement is 20pcs (same motherboard).
3. Silent, dust-free & energy-efficient operation.
4. Simple assembling and Easy system integration.
5. Compatible with different types of Mini-ITX motherboards.
6. Support two 2.5" SATA HDD/SSD.

Specification :

1. Innovative thermal cooling-combination of thermal pads and copper thermal blocks.
2. Enhanced thermal solution-extensive aluminum-made heat sink (top cover & two sides panels).
3. Passive cooling chassis could only dissipate CPU with less than 35 Watts.
4. TDP (please note the compatibility of motherboard and Travla Fanless chassis).

• 
  Fanless Enclosures
• 
  Fanless Enclosures
• 
  Fanless Enclosures