Hot Air Leveling Multilayer PCBs

Model No: Gist 1
Factory Location: Taiwan
Sample Request: No
Target Markets: Worldwide

Detail Information

Description :

1. Characteristics:
(1) All PCBs 100% tested.
(2) UL recognized.
(3) Competitive price and punctual delivery.
(4) Redesigned panel array for optimal space efficiency.
(5) Small, big or OEM orders are welcome.
(6) We help you to source component suppliers.
(7) OEM orders for SMT and A/I assembly projects are accepted.
2. Production process options:
(1) Glide-coating and hot air leveling.
(2) Nickel and gold plating.
(3) Dry film and photo-liquid resistant solder mask.
(4) V-cut, pushback, route and press fabrication.
3. General properties:
(1) IPC-A-600D.
(2) MIL-STD-105D for samples.
(3) MIL-13949.
(4) Customer's specifications.

Specification :

Hot air leveling multilayer PCB with four layers.