Description :

‧Magentically shielded and low radiation.
‧The product has good heat durability that withstands lead-free compatible reflow soldering conditions.
‧Lead-free material is used for the plating on the terminal.
‧Flat boffom for reliable surface mounting.
‧Density design small size and low cost.

APPLICATIONS:
‧Personal computers
‧ADSL / VoIP
‧Hard disk drivers
‧Other electronic equipment

Specification :

Please refer to the attached file for the specification details.

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  Wire Wound Chip Inductors