Description :

Application： for chips terminal dipping of passive components
Carrier： Carrier Plate series, CP
Chips： 0402, 0603, 0805 and above
Capacity： Depends on chips’ specification which will affect capacity.

Specification :

• Paste thickness precision:±0.01mm
• Action precision: ±0.002mm
• Ink tray plate flatness: ±0.005mm
• The parallelism tolerance between dipping plate and ink tray: ±0.05mm
• Adjustable Ink tray thickness:±0.001mm
• Controller: PLC, HMI, Servo Motor…
• Voltage: 220V
• Electric current：10(A)
• Power consumption：50/60HZ
• Frequency：5.5(1/min)
• Air Consumption：1.9(KW)
• Dimension: 875 (L)*900 (W) *1500 mm (H)
• Weight: 720 Kgs

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