Tong Hsing is the professiional manufacturer in microelectronic module packaging- C4 & GGI flip chip ( controlled collapse chip connection), gold interconnections, backend operations, wafer grinding & dicing, IC packaging & test service, semiconductor IC testing, IC assembly packaging, TEMEX CSP, dram CSP bridge thin film copper lead frame, ultra thin, RF modules, LED substrate, thin film DPC on ALN substrates, thin film DPC, SiP Assembling, automotive ( auto) electronics ( electricity modules.