Tong Hsing is the professiional manufacturer in microelectronic module packaging - MEMS assembly, MEMS packaging, ceramic circuit substrate, hybrid substrate, ceramic thick film substrate, thick film substrate, available substrate technology, substrate manufacturing services, thick film substrate manufacturing, outsourced substrate technology, LTCC ( low temperature co fire ceramic), laminate, thin film on copper lead frame technology, assembly packaging services, SMT, COB, C4 & GGI flip chip ( controlled collapse chip connection), gold interconnections, back end technology, backend operations, wafer grinding & dicing, IC packaging service, semiconductor IC testing, IC test service, IC assembly packaging, TEMEX CSP for MEMS and saw, dram CSP bridge thin film copper lead frame, ultra thin, RF...