1. Conductor: 1oz Cu, double side layer, RA copper.
2. Base film: 1mil Polyimide.
...
SMT placement down to 0201
BGA placement
Through hole assembly
Soldering to IPC-A-...
1. Conductor: 2oz Cu, double side layer, RA copper.
2. Base film: 1mil Polyimide.
...
1. Multi-layers with buried and blind via.
2. Surface: HASL, immersion gold, Entek,...
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