Epoxy Compounds For Electronic Application

Model No: N/A
Factory Location: Taiwan
Sample Request: No
Target Markets: Worldwide

Detail Information

Description :

Description:
It is suitable for several typical electronic products as potting, adhesive, sealing, coating and other functions. We provide customized products according to customers' applications.

Product Application:
Decoration coating, IC, LED, circuit boards, capacitor, resistor, inductor, circuit board, power converter, capacitor, relays, commutator, and other electronic parts.

Specification :

Application	One/ two components	Curing condition	Product name	Features	TDS Download
Application	One/ two components	Curing condition	Product name	Features	Chinese	English
Potting	Two	RT curing	5419A/B	Clear.	5419A/B	5419A/B
	Two	RT curing	5250A/B	Black.	5250A/B*	5250A/B*
	Two	RT curing	5433A/B	Low coefficient of thermal expansion.	5433A/B	5433A/B
	Two	Heat curing	5086A/B	Black color and high Tg.	5086A/B*	5086A/B*
Adhesive	One	Heat curing	2089、2095、2066	The minimum shrinkage.	2089,2095, 2066*	2089,2095, 2066*
	One	Heat curing	2070-1、2073、2074	High thermal conductivity,recommended for adhesion on various electronic parts.	2070-1,2073	2070-1,2073
	Two	RT curing	2500A/B	Fast curing.	2500A/B*	2500A/B*
Impregnation	Two	Heat curing	5669A/B	Low viscosity.	5669A/B*	5669A/B*
Flame-resistant			5350A/B( XX)、5351A/B( XX)、2080(XX)	UL Recognized Component (UL94 V-0.5VA)