Tong Hsing Electronic Ind., Ltd.

Manufacturer of Electronic Parts & Components.

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All Products

GGI Flip Chips ( MEMS Packaging)
  • Model No:
    N/A
  • Product Description:
    1. MEMS packaging is a method of fabricating a package for a micro-electromechanical systems (MEMS) device.
    2. SiP assembly, allowing for a simpler chip design requirement, lower cost, shorter time-to-market and better wafer yield, can be applied to...
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Thick Film Ceramic Substrates ( MEMS Packaging)
  • Model No:
    N/A
  • Product Description:
    1. MEMS packaging is a method of fabricating a package for a micro-electromechanical systems (MEMS) device.
    2. SiP assembly, allowing for a simpler chip design requirement, lower cost, shorter time-to-market and better wafer yield, can be applied to...
Inquire Add to Basket